The use of PicTec offers the following advantages:

The PicTec system can be applied universally, for all materials of cladding, to all types of underlying structures. The following claddings can be connected to aluminium or steel substructures:
- natural stone tiles
- ceramic tiles
- fibre cement tiles
- HPL tiles
- metal cladding
- wood claddings
- glass claddings

PicTec is a single-component adhesive.

At a working temperature range between -10° (can be optional less)
and +40°.

PicTec can be applied in both dry and wet environments, which offers an advantage in con nection with the wet working of natural stone for example.

No preperation for substructure and cladding except for the cleaning process is needed.

PicTec dries quickly, with an "open time" of 10 minutes and is tack-free after 30 minutes. While the glue dries the double-sided adhesive tape covers the connection.

PicTec is not conductive, it remains elastic with a high elastic strength and can therefore absorb stresses resulting from temperature fluctuations.

PicTec forms a tough skin (hardness: shore A-60), and has a high tensile strength of at least 2 N/mm².

PicTec is resistant to vibration, ageing, weathering, UV rays and torsion. The adhesive bonds provide both thermal and electrical insulation (no transfer of heat/cold).

The adhesive bonds are 'continuous' joints. Deforming or weakening the materials to be connected, such as is the case with rivets and bolts, is not necessary with adhesive bonds. The adhesive bonds ensure an even distribution of stresses in the joint, which means that a high fatigue strength can be obtained.

The bonds are impermeable to liquid and gas, thus preventing any electrolytic crevice corrosion. The adhesive bonds absorb vibrations and noise.